QuickLogic’s ArcticLink Platform Now Available In Wafer-Level Chip Scale Packaging

Significantly reduces board space requirement for mobile applications

60% reduction in foot print compared to the smallest ArcticLink BGA package

Sunnyvale, CA – May 28, 2008 -- Continuing its commitment to addressing the needs of the mobile device market, QuickLogic® Corporation (NASDAQ: QUIK), has made its ArcticLink™ Customer Specific Standard Product (CSSP) platform available in a tiny Wafer Level Chip Scale Package (WLCSP). The ArcticLink platform family addresses the connectivity needs of mobile devices by offering, in

“As mobile devices grow in complexity, designers are hard pressed to pack additional functionality and intelligence into smaller footprints,” said QuickLogic’s senior solutions marketing manager, Howard Li. “By delivering our ArcticLink CSSP platform in WLCSP form, we allow handset OEMs and ODMs to address all their connectivity needs in the smallest possible area.”

WLCSP eliminates the area overhead of conventional BGA packaging and it is done with a standard die by fabricating an additional metal redistribution layer to re-route the I/O lines from the perimeter bonding pads to an array. It then “bumps” (adds solder balls to) the array, making it ready for customers to use in conventional surface-mount fabrication processes.

Availability

The WLCSP packaging option is immediately available for QuickLogic’s ArcticLink CSSP platform family.

About QuickLogic
QuickLogic Corporation (NASDAQ: QUIK) is the inventor and pioneer of innovative, customizable semiconductor solutions for mobile and portable electronics OEMs and ODMs. These silicon plus software solutions are called Customer Specific Standard Products (CSSPs). CSSPs enable our customers to bring their products to market more quickly and remain in the market longer, with the low power, cost and size demanded by the mobile and portable electronics market. For more information about QuickLogic and CSSPs, visit www.quicklogic.com.

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